CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment
Department of Commerce
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment. For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov . If you have any questions on how to apply, please email apply@chips
Funding
Award size
Not specified
Type
Cooperative Agreement
Dates
Deadline
Next 90 days
Posted
09/29/2023
Closes
2026-11-01
Eligibility
Eligibility
Others (see text field entitled "Additional Information on Eligibility" for clarification)
Program
Funding area
Science and Technology and other Research and Development - ST
Opportunity #
2023-NIST-CHIPS-SMME-01
Source
Status
Open
Market
Government
Level
Federal
Source
Grants.gov