80NSSC24PC199 MULTICHIP MODULE PACKAGE FOR SIC PRESSURE SENSORS
National Aeronautics and Space Administration
80NSSC24PC199 MULTICHIP MODULE PACKAGE FOR SIC PRESSURE SENSORS
Funding
Recipient
SIENNA TECHNOLOGIES, INC.
Award size
Under $100K
Award ceiling
60000
Type
Contract
Procurement type
Purchase Order
Dates
Posted
2026-11-18
Closes
2026-11-18
Program
NAICS
Other Electronic Component Manufacturing - 334419
Opportunity #
80NSSC26P0915
Source
Industry
Manufacturing
Status
Awarded
Market
Government
Level
Federal
Source
USAspending.gov